19 de January de 2025
By : Airspan / 0 Comments
SENIOR MECHANICAL ENGINEER RICHARDSON • TEXAS, USA About Airspan Networks Airspan Networks is a leading provider of groundbreaking wireless solutions, enabling connectivity for the next generation of mobile and fixed networks. With a global presence, Airspan focuses on delivering innovative technologies that drive advancements in Open RAN and accelerate 5G adoption worldwide. Backed by strong investments and a team of world-class experts, Airspan supports telecom operators and enterprises in achieving their digital transformation goals. At Airspan, we’re on the cutting edge of 4G and 5G RAN software and hardware development, creating innovative solutions that drive the future of wireless connectivity. With over a million cells deployed worldwide, our disruptive Open RAN platform is transforming carrier networks and critical infrastructure across the globe. Airspan is more than just a workplace; it’s a launchpad for your career. We are dedicated to pushing the boundaries of technology and innovation, ensuring a bright future for both our company and our employees. Our greatest strength lies in our people—a team of brilliant minds from diverse backgrounds working together to achieve extraordinary results. With offices in the USA, UK, India, Colombia, Poland, Japan, and Israel, Airspan offers a global working environment that values collaboration, creativity, and excellence. Whether you’re based in one of our offices or working remotely, you’ll be part of a dynamic team shaping the future of connectivity. About the Role: As a Senior Mechanical Engineer, you will join Airspan’s dynamic and highly experienced team, working to design and develop mechanical systems for radio base stations that support multiple radio access technologies, including 5G, 4G/LTE, and GSM. This role offers the opportunity to contribute to the evolution of wireless technology by driving innovative mechanical designs that meet stringent performance, environmental, and manufacturing requirements. Airspan’s hardware portfolio is built for scalability and reliability, with over 50,000 5G radios and 700,000 4G radios deployed in live networks worldwide. Our solutions meet the demands of public and private networks with unmatched efficiency and performance, spanning dense urban deployments and expansive industrial applications. With proven success in Open RAN interoperability and conformance testing, Airspan continues to innovate and deliver cutting-edge wireless solutions. Key Responsibilities: Lead hardware development and technical detailed design within the mechanical domain. Define requirements and create conceptual layouts for product designs using 3D CAD software such as Creo or SolidWorks. Develop detailed drawings for fabrication, ensuring designs align with manufacturing capabilities. Perform thermal analysis and simulations to evaluate and optimize thermal performance of critical components. Assist in procurement and support manufacturing production activities. Facilitate Design for Manufacturability (DFM) by collaborating with internal and external tooling and process development teams. Work closely with hardware, supply chain, and project management teams to ensure alignment with project goals and timelines. Validate product performance against requirements using design and simulation tools. Perform assembly-level tolerance analyses to ensure mechanical fit and functional reliability. Assemble small quantities of prototypes in a lab environment to verify mechanical fit, function, and tolerances. Design fixtures and implement rapid prototyping techniques to support development and testing. Create detailed documentation and specifications for prototyping, quoting, and production readiness. Key Qualifications: Bachelor’s degree in Mechanical or Mechatronic Engineering (advanced degrees are a plus). Minimum of 5 years of experience in designing and shipping commercial products. Prior experience with designing or supporting outdoor-rated telecommunications equipment is highly desirable. Proficiency in 3D CAD software such as Creo or SolidWorks, with accompanying 2D drafting skills. Expertise in designing plastic, die-cast, extruded, and machined parts. Familiarity with printed circuit boards (PCBs) and their mechanical integration. Experience working with high-volume manufacturing processes. Knowledge of thermal modeling, simulation, analysis, and testing for electronic equipment, including experience with thermal modeling software such as ANSYS IcePak and Flotherm. Familiarity with designs for outdoor environments that meet IP65 or similar ratings. Experience with product safety certifications such as UL, CSA, and CE is preferred. Strong understanding of various electronic interconnection types and their performance trade-offs. Demonstrated ability to manage multiple projects and meet tight deadlines in a fast-paced environment. Why Join Us?: At Airspan, you’ll work in an environment that values flexibility and innovation. Whether you’re an experienced professional or looking to grow your career, you’ll be joining a team that prioritizes collaboration and creativity. Be part of a company with a global reach, a strong track record, and an exciting vision for the future of wireless connectivity.
19 de January de 2025
By : Airspan / 0 Comments
SENIOR DIGITAL HARDWARE ENGINEER RICHARDSON • TEXAS, USA About Airspan Networks Airspan Networks is a leading provider of groundbreaking wireless solutions, enabling connectivity for the next generation of mobile and fixed networks. With a global presence, Airspan focuses on delivering innovative technologies that drive advancements in Open RAN and accelerate 5G adoption worldwide. Backed by strong investments and a team of world-class experts, Airspan supports telecom operators and enterprises in achieving their digital transformation goals. At Airspan, we’re on the cutting edge of 4G and 5G RAN software and hardware development, creating innovative solutions that drive the future of wireless connectivity. With over a million cells deployed worldwide, our disruptive Open RAN platform is transforming carrier networks and critical infrastructure across the globe. Airspan is more than just a workplace; it’s a launchpad for your career. We are dedicated to pushing the boundaries of technology and innovation, ensuring a bright future for both our company and our employees. Our greatest strength lies in our people—a team of brilliant minds from diverse backgrounds working together to achieve extraordinary results. With offices in the USA, UK, India, Colombia, Poland, Japan, and Israel, Airspan offers a global working environment that values collaboration, creativity, and excellence. Whether you’re based in one of our offices or working remotely, you’ll be part of a dynamic team shaping the future of connectivity. About the Role: As a Senior Digital Hardware Engineer, you will join Airspan’s dynamic and highly experienced team, working to design and develop digital systems that support multiple advanced technologies. This role offers the opportunity to contribute to the evolution of technology by driving innovative designs that meet stringent performance, environmental, and manufacturing requirements. Airspan’s hardware portfolio is built for scalability and reliability, with proven success in delivering cutting-edge wireless solutions that meet the demands of public and private networks with unmatched efficiency and performance. Key Responsibilities: Lead hardware development within digital and mixed signal domain for cellular radio infrastructure products. Ownership of PCBA design from concept phase to full final design and EVT/DVT phase of the product. Design and implement power management and power sequencing circuitry. Develop high-speed clock and distribution circuitry. Work with system engineers to derive block-level specifications based on target requirements. Perform feasibility studies and participate in early project estimates. Work closely with RF, analog, digital, test, and firmware engineers. Lead board bring-up activities, conduct detailed performance characterization, optimization, and debug. Support procurement and manufacturing production activities. Key Qualifications: Bachelor’s degree in Engineering from an accredited institution (advanced degrees are a plus). Minimum of 10 years of experience in high-performance digital hardware design. Strong experience with high-speed digital interfaces such as JESD, DDR, eCPRI. Proficiency in mixed signal chain, analog circuitry, microcontrollers, FPGAs, and SoCs. Familiarity with various data protocols: USB, UART, I2C, SPI, JTAG. Strong background with standard tools used to perform schematic capture and layout (e.g., OrCad, Cadence). Experience working with high-volume manufacturing processes. Experience in design for ESD compliance and safety. Hands-on experience in using spectrum analyzers, high-speed oscilloscopes, signal generators, and other standard lab equipment. Experience with signal integrity (SI) simulations is a plus. Demonstrated ability to manage multiple projects and meet tight deadlines in a fast-paced environment. Why Join Us?: At Airspan, you’ll work in an environment that values flexibility and innovation. Whether you’re an experienced professional or looking to grow your career, you’ll be joining a team that prioritizes collaboration and creativity. Be part of a company with a global reach, a strong track record, and an exciting vision for the future of wireless connectivity.
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